Applications of Adhesives for Motor Industry

Leave a Comment / Automotive, Consumer Electronics, Industrial Electronics, Manufacturing, Motor /

1.Development Trends of Permanent Magnet Synchronous Motors 1.1 Technological Innovations (1) In the field of permanent magnet materials, new types of materials are continuously emerging, featuring higher magnetic energy density and lower magnetic hysteresis losses. These advancements enable higher torque and operational temperatures. Additionally, the development of alternatives to rare earth materials is increasing, aimed […]

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Application of Adhesives in the OLED Industry

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1. Trends in OLED Development OLED devices are evolving towards higher performance, lower energy consumption, and broader applications. This transformation is not only reshaping the consumer electronics market but also opening new possibilities in various sectors such as the industrial and medical fields. 1.1 Flexible and Foldable Displays Flexible OLED screens represent a crucial development

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Applications of Adhesives in Type-C Transmission Interfaces

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1. Type-C Development Trends 1.1 Technical Performance (1) Faster Transmission Speeds: With support for standards from USB 3.1 and 3.2 to USB4, future transmission speeds are expected to reach several tens of Gbps or even higher. (2) Enhanced Charging Capability: Higher voltage and current support will facilitate faster charging speeds, and bidirectional charging will become

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Adhesives for Mobile Phone and Automotive Camera Modules

Leave a Comment / Automotive, Consumer Electronics, Data&Telecom Infrastructure, Industrial Electronics, Manufacturing, Motor /

To achieve miniaturization and high performance in camera modules, advanced packaging technologies such as Chip-on-Board (COB), Flip Chip (FC), and Wafer-Level Package (WLP) have been widely adopted in their manufacturing. These packaging techniques enhance the integration, reliability, and production efficiency of the modules while reducing manufacturing costs. Concurrently, the performance of packaging materials is continuously

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Adhesives Used For Fingerprint Recognition Module Packaging

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Fingerprint recognition technology has advanced significantly, with each packaging process tailored to meet specific performance requirements. This guide outlines the current methods of fingerprint recognition chip packaging, emphasizing the role of adhesives in enhancing reliability and efficiency. 1 Fingerprint Recognition Chip Packaging Processes 1.1 Wirebonding Process Wirebonding remains the most prevalent method for packaging fingerprint

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Adhesives Used For Camera Compact Module (CCM)

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Camera Compact Module, abbreviated as CCM, is an image input device that is closely related to our social life. Photography, videography and videography are all relied on it, and are widely used in automotive electronics, mobile phones and computers, medical imaging and security monitoring. The camera module is small in size, but the internal structure

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